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Abstract

There are disclosed an apparatus and method for cleaning a precision substrate through use of high-frequency- or ultrasonic-applied cleaning liquid. An object substrate is horizontally held and rotated. High-frequency- or ultrasonic-applied cleaning liquid is jetted toward the surface of the object substrate from first cleaning liquid jetting unit disposed above the object substrate, and the nozzle of the first cleaning liquid jetting unit is moved in parallel with the surface of the object substrate. Cleaning liquid is also fed toward the central portion of the surface of the object substrate from cleaning liquid feed-to-center unit during cleaning. In the cleaning apparatus and method, a sufficiently high cleaning speed is attained. Further, there is not involved the problem that the film of cleaning liquid becomes thin on the central portion of a substrate during cleaning due to the effect of a centrifugal force with a resultant difficulty in transmission of high frequency or ultrasonic vibration to the central portion and the problem that during cleaning, due to the effect of a centrifugal force, no liquid film is present on the central portion, which thus becomes dry and contaminated. The cleaning apparatus and method also proves a cost advantage.

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First Claim