Chip and board stress relief interposer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Apr 18, 2000
Grant Date -
N/A
app pub date -
Aug 7, 1998
filing date -
Aug 7, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An interposer structure permits a differential transverse displacement of contact pads on opposite sides of the interposer to reduce thermal stresses when the interposer is bonded to contact pads of a chip and a substrate with different thermal coefficients of expansion. The effective elasticity of the interposer between top and bottom contact pads of the interposer is facilitated by perforations which define flap-like regions. A flexible trace couples top contact pads to bottom contact pads through a via while permitting substantial transverse relative displacement of the top and bottom contact pads in flap-like regions.
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