Angularly offset stacked die multichip device and method of manufacture
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United States of America Patent
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-
Apr 18, 2000
Issued Date -
N/A
app pub date -
Jul 24, 1998
filing date -
Aug 16, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An offset die stacking arrangement is disclosed having at least one upper level die having a width which is less than the distance separating the opposing bonding sites of the underlying die. The upper die is fixed above the lower die and rotated within a plane parallel to the lower die through an angle which insures that none of the bonding sites of the lower die are obstructed by the upper die. Once the dice are fixed in this manner, the entire assembly is subjected to the wire bonding process with all of the bonds being made in the same step.
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Cited Art Landscape
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