Method of flip-chip bonding between a chip element and a wafer-board
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United States of America Patent
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Apr 25, 2000
Grant Date -
N/A
app pub date -
Aug 6, 1998
filing date -
Aug 6, 1997
priority date (Note) -
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Abstract
A method of bonding a chip element to a wafer-board through at least a solder bump having a surface coated with an oxide layer placed between the chip element and the wafer-board is provided. The method comprises the following steps. The oxide layer coating the surface of the solder bump is exposed to a liquid. An energy is given to the solder bump both for melting the solder bump and for causing at least one of a convection and a cavitation of at least an adjacent part of the liquid to the oxide layer, so as to allow the at least one of the convection and the cavitation to remove the oxide layer from the surface of the solder bump, whereby the solder bump bonds the chip element and the wafer-board.
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