Water slide for transferring semiconductor wafers
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United States of America Patent
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Apr 25, 2000
Grant Date -
N/A
app pub date -
Aug 29, 1997
filing date -
Aug 29, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A water slide for semiconductor wafer processing minimizes water usage by confining water to flow within spaced-apart grooves in the absence of a wafer. When a wafer passes down the water slide, a meniscus of water formed above the grooves is spread out to occupy the space underneath the wafer and prevent it from contacting the water slide as the wafer travels down the water slide.
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