Process for adhesively attaching a temporary lid to a microelectronic package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 25, 2000
Grant Date -
N/A
app pub date -
Jan 22, 1998
filing date -
Jan 22, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process and apparatus for picking up and moving a microelectronic package during card assembly operations. A temporary lid having a top surface and a bottom surface attaches to at least one microchip on a substrate via a double-sided adhesive. The top surface of the lid provides a clean, smooth, flat surface to which a vacuum probe may be attached. After completion of the steps where vacuum probe movement is required, the lid and adhesive may be removed from the at least one microchip by pulling them both off together. No residue is left on the microchips.
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