Halogen additives for alkaline copper use for plating zinc die castings
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United States of America Patent
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Apr 25, 2000
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N/A
app pub date -
Nov 11, 1998
filing date -
Nov 11, 1998
priority date (Note) -
Expired
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Abstract
A method and electrolyte bath for depositing Cu.sup.+1 ions from the cathode diffusion layer onto a zinc substrate. Halogen ions are used as additives to organophosphonate alkaline copper electrolytes for stabilizing Cu.sup.+1 in the cathode diffusion layer.
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