Thin type semiconductor package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Apr 25, 2000
Issued Date -
N/A
app pub date -
Jul 9, 1997
filing date -
Mar 22, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor package having a board, at least one semiconductor chip, and flat type external connecting terminals, the board having a wiring circuit including connecting portions on a first main surface, the semiconductor being mounted on the first main surface, the flat type external connecting terminals being electrically connected to the semiconductor chip and formed on a second main surface of the board, wherein the flat type external connecting terminals are disposed in such a manner that any straight line which is arbitrarily drawn across the surface of a region to form the flat type external connecting terminals of the board runs on at least one of the flat type external connecting terminals.
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