Epoxy/thermoplastic photocurable adhesive composition
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United States of America Patent
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May 2, 2000
Grant Date -
N/A
app pub date -
May 1, 1998
filing date -
May 1, 1998
priority date (Note) -
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Abstract
A curable composition comprising a) a curable epoxy resin, a thermoplastic ethylene-vinyl acetate copolymer resin, and an effective amount of a photocatalyst for the curable epoxy resin, wherein the composition is free from hydrocarbon polyolefins and wherein the sum of a) and b) is 100 weight percent.
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