Plastic integrated circuit card with an enclosed reinforcement structure separated from an integrated circuit module for protecting the integrated circuit module
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United States of America Patent
Stats
-
May 2, 2000
Issued Date -
N/A
app pub date -
Jul 29, 1996
filing date -
Feb 14, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A reinforcement structure to protect an integrated circuit module located within a smart card. The integrated circuit module is disposed in the smart card. The reinforcement structure, which has a modulus of elasticity higher than the modulus of elasticity of the smart card, is completely surrounded by the smart card and separated from the integrated circuit module. The integrated circuit module can also be completely surrounded by the smart card. In addition, the smart card can have a plurality of layers, with the integrated circuit module and/or the reinforcement structure extending into one or more of the card layers. The reinforcement structure relieves stress on the integrated circuit module during bending and torsion of the card.
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