Micro grid array solder interconnection structure for second level packaging joining a module and printed circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 9, 2000
Grant Date -
N/A
app pub date -
Mar 5, 1998
filing date -
Mar 5, 1998
priority date (Note) -
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Importance
Abstract
A solder interconnection between a module and printed circuit board or card is provided by a plurality of solder connections arranged in a micro grid array joining solder wettable pads on a major surface of the module to a corresponding set of solder wettable pads of the printed circuit board or card. The solder connections are column shaped with the height of each connection being at least about 1.4 times the diameter of the connection.
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