Semiconductor structure interconnector and assembly
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United States of America Patent
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May 9, 2000
Grant Date -
N/A
app pub date -
Sep 24, 1997
filing date -
Sep 24, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An assembly and process for connecting opposed semiconductor structures (12,14) comprising at least two structures. An interconnect (16) between the structures (12,14) connects the structures in opposed spaced relation to each other. The interconnect comprises a first material (18) and a second material (20). The first material comprises a resiliently flexible center portion. The second material comprises an electrically conductive outer portion surrounding the first material. The second material and the first material provide the interconnect with a flexibly compliant characteristic for maintaining an electrically conductive relationship between the structures.
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