Method for cleaning a semiconductor wafer
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United States of America Patent
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-
May 9, 2000
Issued Date -
N/A
app pub date -
Jul 27, 1998
filing date -
Feb 15, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor cleaning method for removing particles that have adhered to the back side of a semiconductor wafer. The semiconductor wafer is placed on a support. Inert gas is blown against the back of the semiconductor wafer by a plurality of nozzles, each of which is positioned at a predetermined angle to the back of the semiconductor wafer and inclined in a first direction. An air exhaust is located near the periphery of the semiconductor wafer and arranged so as to suck in the particles removed from the semiconductor wafer with the nozzles.
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