Micro probe assembly and method of fabrication
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 9, 2000
Grant Date -
N/A
app pub date -
Sep 30, 1997
filing date -
Sep 30, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A probe assembly including an integral fine probe tip, conductive line with terminal connection for testing semiconductor devices and a method of construction of the probe assembly is described. The method of construction described utilizes the step of etching pits into silicon wafers to produce molds for forming the probe point. Semiconductor machining processes are used to complete the probe assembly.
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