Mechanically restricted laser deposition
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 9, 2000
Grant Date -
N/A
app pub date -
Mar 31, 1998
filing date -
Mar 31, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus for metal line deposition and a method for metal line deposition using the apparatus. A donor plate has a donor substrate transparent to a focused coherent light beam and a donor surface. The donor surface of the donor plate has a channel formed therein. The channel is coated with a metallic material. A deposition substrate onto which the metal line is to be deposited is disposed adjacent the donor surface of the donor plate. The focused coherent light beam is directed through the donor substrate of the donor plate and onto the metallic coating in the channel. The focused coherent light beam causes the metallic material to ablate from the channel by discharging ions of the metallic material away from the channel and onto the deposition substrate to form the metal line.
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