Metal-film laminate resistant to delamination
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United States of America Patent
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May 9, 2000
Issued Date -
N/A
app pub date -
Jul 10, 1997
filing date -
Sep 13, 1990
priority date (Note) -
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Abstract
A flexible metal-film laminate can comprise a layered film structure having a metal layer securely bonded to a film layer. The laminate contains a unique metal-oxide attachment structure between the film and metal layer comprising randomly distributed regions of metal-oxide. After the metal/metal-oxide layer, a chromium metal or chromium alloy layer is formed before subsequent layers of copper, gold, etc. The peel strength of such a laminate is significantly improved over prior laminates and is resistant to peel strength reduction due to environmental stress. The preferred metal-film laminates made with polyester or polyimide can be used in the manufacture of high-quality, low cost, flexible printed circuit boards.
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