Circuit packaging for millimeter-wave components
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United States of America Patent
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-
May 9, 2000
Grant Date -
N/A
app pub date -
Apr 6, 1998
filing date -
Apr 6, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A module for a millimeter-wave component having environmentally sensitive components, such as with chip and wire technology, is described which does not require that the entire module be hermetically sealed against the outside elements in order to protect the environmentally sensitive component. A cap is placed over the environmentally sensitive component in order that the vulnerable component itself is protected from the external environment. The less-vulnerable remainder of the millimeter-wave module can withstand limited exposure to environmental conditions and, therefore, is not necessarily sealed.
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