Curable polyolefin compositions containing organosilicon compounds as adhesion additives
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United States of America Patent
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May 9, 2000
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N/A
app pub date -
Sep 4, 1998
filing date -
Sep 4, 1998
priority date (Note) -
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Abstract
The presence in curable polyolefin compositions of a moisture curable organosilicon compound containing at least one alkenyloxy group bonded to the silicon atoms improves the adhesion to a variety of substrates that is developed during the curing reaction of polyolefin compositions cured by a hydrosilation reaction. The organosilicon compound is preferably a reaction product of ingredients comprising 1) a silane or bis-silylalkane containing at least three silicon-bonded moisture-reactive groups per molecule and 2) an organic compound containing at least one carbinol group and at least one ethylenically unsaturated group.
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