Multilayer LC complex component
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United States of America Patent
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May 9, 2000
Grant Date -
N/A
app pub date -
Jun 30, 1998
filing date -
Jun 30, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The object of the present invention is to provide a multilayer LC complex component which is capable of improving reliability by reducing frequency of cracks and achieving better strength, especially resistance against flexure thereof. In an embodiment of the present invention, two patterns of conductors for capacitor R1 and R2 are stacked alternately, and conductors for capacitor R1 are connected to each other through via holes R3 and R4. Capacitor 30 is connected to inductor 12 through via hole D3 which passes through aperture R5 formed in conductor for capacitor R2. As there are plural pillars of via hole formed in the right, left and central part of the present invention, this structure achieves improvement of strength of the central part thereof wherein most of stresses caused by flexure and bending concentrate.
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