Substrate heat-treating apparatus
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United States of America Patent
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May 16, 2000
Grant Date -
N/A
app pub date -
Apr 14, 1998
filing date -
Apr 22, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A substrate heat-treating apparatus includes a heat-treating plate, and support pins extending through the heat-treating plate to be vertically movable relative thereto. The support pins support each substrate at a lower surface thereof such that edges of the substrate are at a higher level than a central region of the substrate. This construction facilitates air flows into and out of a space between the lower surface of the substrate and the upper surface of the heat-treating plate when the substrate is vertically moved.
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