High density test probe with rigid surface structure
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United States of America Patent
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May 16, 2000
Issued Date -
N/A
app pub date -
May 13, 1998
filing date -
Nov 27, 1995
priority date (Note) -
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Abstract
The present invention is a structure for probing an electronic device. The structure has a layer of elastomeric material having a first side and a second side; a plurality of electrical conductors extending from the first side to the second side; each of the electrical conductors has a first end and a second end, the first end extends to the first side, the second end extends to said second side; a layer of dielectric material disposed on the first side; the first end of the plurality of electrical conductors extends into openings in the layer of dielectric material. More particularly, in the present invention, the second side is disposed in contact with a first surface of a substrate and the second ends of the electrical conductors are electrically connected to first electrical contact locations on the first surface.
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