Process for three dimensional inspection of electronic components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
May 16, 2000
Issued Date -
N/A
app pub date -
May 28, 1999
filing date -
Jan 16, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A three dimensional inspection process for ball array devices. The ball array device is positioned in a fixed optical system. The ball array device is illuminated and a first image of the ball array device is taken with a first camera disposed in a fixed focus position relative to the ball array device to obtain a characteristic circular doughnut shape image from a ball. A second image of the ball array device is taken with a second camera disposed in a fixed focus position relative to the ball array device to obtain a top surface image of the ball. The first image and the second image are processed using a triangulation method to calculate a three dimensional position of the ball with reference to a pre-calculated calibration plane.
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