Method for making elastic bumps from a wafer mold having grooves
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United States of America Patent
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May 30, 2000
Grant Date -
N/A
app pub date -
Dec 19, 1997
filing date -
Dec 19, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
This invention relates to a manufacturing process for making elastic bumps in the micro-electronic field. It solves the problem to mould micrometer sized elastic features by means of a micro-machined mould. The method is a reproducible moulding technology to achieve elastic bumps being a perfect replication of the mould. The mould is made of one or several grooves etched in a silicon wafer. The method includes the steps of: cleaning the surface of the mould (100) from dust and other particles; depositing a release agent on the mould and the release agent, e.g. Parylene or silane, forming a conformal self-assembled layer (118) on the surface of the mould; putting on a curable elastomer, to form an elastomeric structure (208) on the mould; curing the mould and the structure; and separating the structure from the mould.
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