Semiconductor device and method of fabrication
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United States of America Patent
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May 30, 2000
Grant Date -
N/A
app pub date -
Aug 18, 1997
filing date -
Aug 18, 1997
priority date (Note) -
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Abstract
This invention relates to the fabrication and assembly of semiconductor chips, substrates, and modules, and more particularly to methods and apparatus for achieving flexible, low-cost manufacturing. Commercial and military systems today are placing increasing demands on flexible application and reliable operation, as well as on simplified manufacturing.
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