Importance

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Abstract

A method for connecting, both mechanically and electrically, an electrically conducting field emission fiber (31) to an electrically conducting area of a substrate (32) involving placing the field emission fiber (31) across the surface of the substrate (32) and centering the field emission fiber (31) over the area of the substrate (32) where the connection is to be made, placing a metal ribbon (33) over the field emission fiber (31) with the dimension along the length of the metal ribbon (33) essentially perpendicular to the axis of the field emission fiber (31) and such that the metal ribbon (33) extends over the field emission fiber (31) with each end portion of the metal ribbon (33) in direct contact with the conducting area of the substrate (32), and bonding the metal ribbon (33) to the area of the substrate (32) and to the field emission fiber (31) by means of ultrasonic, thermocompression or compression bonding, substantially as shown in the figures, and described in the specification. The present method of connecting a field emission fiber to a substrate may be readily automated such that a multitude of such connections can be made.

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First Claim