Semiconductor wirebond machine leadframe thermal map system
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United States of America Patent
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Jun 6, 2000
Grant Date -
N/A
app pub date -
Oct 3, 1997
filing date -
Oct 3, 1997
priority date (Note) -
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Abstract
A method and apparatus for measuring the surface temperatures of wire-bonded semiconductors and the like for preparing thermal maps include a conventional ultrasonic wire bonding machine adapted for mounting a fluorescence-decay temperature sensor in the capillary holder. A trigger box circuit is provided to trigger a temperature measurement based on initiation of an electrical voltage signal from the ultrasonic bonding controller. A computer is provided for coordinating the stage control and temperature measurements, and for collating and plotting the temperature, time and location indications as thermal maps and other displayed/printed correlations.
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