Method for holding components in place during soldering
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 6, 2000
Grant Date -
N/A
app pub date -
Aug 20, 1998
filing date -
Aug 20, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for fabricating a printed-circuit board includes the steps of loading components onto the printed circuit board, and placing a pin array over the components. Each pin is free to move 'downward,' and each component has at least one pin pressing on it to hold the component in place. Each component also preferably has a pin on each side of it, to hold it against lateral movement. The pin support arrangement is dimensioned so that a gap or space exists between the support and the component side of the board. Heat is applied to the gap, and flows through the interstices between the pins to heat the solder on the upper side of the board to fuse the solder and make the desired connections.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully