Passive element circuit

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6072205
SERIAL NO

09090533

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A passive element circuit is formed by a spiral inductor, a high-dielectric-constant thin-film capacitor, a via hole, and a bonding pad. By using SrTiO.sub.3 as the high-dielectric-constant thin-film, which exhibits a dielectric constant of 200 up to a frequency of 20 GHz, it is possible to achieve a reduction of the capacitor surface area to approximately 1/30 of the area formerly required when using a SiN.sub.x (dielectric constant up to 6.5). Two high-dielectric-constant thin-film capacitors, a via hole for grounding, and a bonding pad are disposed at the center, which are surrounded by the spiral inductor. To connect the two high-dielectric-constant thin-film capacitors are joined in series, they are formed on one high-dielectric-constant thin-film. A lead from the spiral inductor is made by a metal wire from the bonding pad at the center.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
NEC CORPORATIONTOKYO10615

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwata, Naotaka Tokyo, JP 18 255
Yamaguchi, Keiko Tokyo, JP 15 72

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Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
INTEGRATED DEVICE TECHNOLOGY, INC. (1)
6798039 Integrated circuit inductors having high quality factors 19 2002
 
VLSI TECHNOLOGY LLC (2)
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Ultrasource, Inc. (9)
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7327582 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2005/0175,938 Integrated thin film capacitor/inductor/interconnect system and method 3 2005
7425877 Lange coupler system and method 1 2005
* 2005/0162,236 Lange coupler system and method 2 2005
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* 2006/0097,344 Integrated thin film capacitor/inductor/interconnect system and method 0 2005
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (2)
6362012 Structure of merged vertical capacitor inside spiral conductor for RF and mixed-signal applications 58 2001
6486529 Structure of merged vertical capacitor inside spiral conductor for RF and mixed-signal applications 20 2002
 
THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK (3)
7847667 Systems and methods for reducing circuit area 0 2007
* 2008/0180,187 SYSTEMS AND METHODS FOR REDUCING CIRCUIT AREA 4 2007
* 2010/0019,300 MULTILAYER INTEGRATED CIRCUIT HAVING AN INDUCTOR IN STACKED ARRANGEMENT WITH A DISTRIBUTED CAPACITOR 5 2009
 
RENESAS ELECTRONICS CORPORATION (1)
7812689 Phase shifter including a resonant type switch with a free region 2 2008
 
GLOBALFOUNDRIES INC. (1)
* 8169050 BEOL wiring structures that include an on-chip inductor and an on-chip capacitor, and design structures for a radiofrequency integrated circuit 8 2008
 
TEXAS INSTRUMENTS INCORPORATED (1)
* 6143614 Monolithic inductor 6 1998
 
SUPERCONDUCTOR TECHNOLOGIES, INC. (1)
6792299 Device approximating a shunt capacitor for strip-line-type circuits 6 2001
 
STMICROELECTRONICS SA (1)
* 6232645 Noise decoupling for semiconductor device with BiCMOS-type substrate 13 1999
 
KABUSHIKI KAISHA TOSHIBA (2)
* 6492707 Semiconductor integrated circuit device with pad impedance adjustment mechanism 6 1998
9774298 High-frequency amplifier 0 2016
 
INFINEON TECHNOLOGIES AG (1)
* 7906831 Semiconductor device with capacitor arrangement electrically coupled to inductor coil 2 2008
* Cited By Examiner