Passive element circuit

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United States of America Patent

PATENT NO 6072205
SERIAL NO

09090533

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A passive element circuit is formed by a spiral inductor, a high-dielectric-constant thin-film capacitor, a via hole, and a bonding pad. By using SrTiO.sub.3 as the high-dielectric-constant thin-film, which exhibits a dielectric constant of 200 up to a frequency of 20 GHz, it is possible to achieve a reduction of the capacitor surface area to approximately 1/30 of the area formerly required when using a SiN.sub.x (dielectric constant up to 6.5). Two high-dielectric-constant thin-film capacitors, a via hole for grounding, and a bonding pad are disposed at the center, which are surrounded by the spiral inductor. To connect the two high-dielectric-constant thin-film capacitors are joined in series, they are formed on one high-dielectric-constant thin-film. A lead from the spiral inductor is made by a metal wire from the bonding pad at the center.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
NEC CORPORATIONTOKYO10582

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwata, Naotaka Tokyo, JP 18 267
Yamaguchi, Keiko Tokyo, JP 18 77

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