Semiconductor component
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jun 6, 2000
Grant Date -
N/A
app pub date -
Apr 7, 1999
filing date -
Apr 7, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor device (10) suitable for use in RF applications and a method of forming the semiconductor device (10). An RF transistor die (31) is bonded to a heatsink (21). The heatsink (21) having the semiconductor chip (31) mounted thereto is coupled to a printed circuit board (11), wherein the RF transistor die (31) extends through an opening (14) in the printed circuit board (11). Conductors (18, 19) on the printed circuit board (11) are coupled to the semiconductor chip (31) via wirebonds (35, 36).
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