Importance

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Abstract

A ball grid array package with an improved structure of aligning balls is disclosed. The BGA package comprises various elements such as a substrate and a semiconductor chip mounted in the substrate. The substrate has a first surface and a second surface which is positioned in a higher place than the first surface and is formed around the first surface. The semiconductor chip is arranged on the first surface, and has a plurality of pads for transferring signals, which is placed on the semiconductor chip. And At least one semiconductor chip is stacked so that the pads having an identical function on each layer are electrically connected to each other. The BGA package includes a plurality of leads which are mounted on the substrate and connected with a part of the pads of the semiconductor chip and exposed to the second surface. Furthermore, the BGA package of the present invention includes a plurality of conductive solder balls which are formed on the surface of the semiconductor chip and the second surface of the substrate, and electrically connected with the leads exposed to the second surface of the substrate and the pads of the semiconductor chip.

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First Claim