Method of forming a via with plasma treatment of SOG

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United States of America Patent

PATENT NO 6074941
SERIAL NO

09113471

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of forming a via is provided comprising a plasma treatment at the spin-on-glass layer after forming the unlanding via. The plasma comprises hydrogen and a second gas. The mist containing in the spin-on-glass layer is damaged and removed away.

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Patent Owner(s)

  • UNITED MICROELECTRONICS CORP.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsieh, Ching-Hsing Pingtung Hsien, TW 16 69
Hsu, Chih-Ching Hsinchu, TW 36 418
Kuo, Yung-Chieh Taipei, TW 10 41
Lu, William Taichung, TW 21 105

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