Semiconductor package substrate with power die
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jun 13, 2000
Grant Date -
N/A
app pub date -
Dec 15, 1997
filing date -
Dec 15, 1997
priority date (Note) -
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Abstract
An apparatus that efficiently delivers electrical power and lowers the inductance to an integrated circuit. In one embodiment, the present invention includes an apparatus for delivering electrical power to an integrated circuit comprising two planes, substantially parallel to one another, having many ground and power traces. The ground and power traces of the separate planes are connected together and connected to the integrated circuit, thereby providing power to the integrated circuit. In each individual plane, the ground and power traces are substantially parallel to each other, one array of traces in one plane substantially perpendicular to another array of traces in another plane. The apparatus being electrically coupled to a printed circuit board having at least one decoupling capacitor with first and second electrodes coupled to at least two of the ground and power connections, respectively, of the integrated circuit through the printed circuit board, and the first and second ground and power planes.
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