Stress clip design
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United States of America Patent
Stats
-
Jun 13, 2000
Grant Date -
N/A
app pub date -
Jan 30, 1998
filing date -
Jun 2, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor package includes a base plate, a semiconductor die having top and bottom surfaces, the bottom surface being mounted to the base plate, and a conductor tab having first and second ends, the first end being adapted to communicate with and couple to external circuitry, the second end including a relatively wide foot having a plurality of finger portions separated by gaps, the finger portions being mounted to an covering a substantial portion of the top surface of the semiconductor die.
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