Inspection device for inspecting a semiconductor wafer

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6075373
SERIAL NO

08862601

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention provides a simple, light-weight inspection device by arranging a mechanical path switching mechanism. The invention includes a device main body, one or more inspection targets having a plurality of connection pads, a test portion for measuring the electrical characteristics of the inspection targets on the basis of electrical signals from the inspection targets, a mounting device for mounting the inspection targets at predetermined positions with respect to the device main body, a probe card having a plurality of probe pads on its upper surface, which are electrically connected to the connection pads of the inspection targets mounted on the mounting device through an electrical contact device, a contact block having contact pins which removably contact the respective probe pads of the probe card, a connection device for electrically connecting the contact pins of the contact block and the test portion, and a contact block support/moving device for movably supporting the contact block in the circumferential direction at the peripheral of the probe card. In the invention, the plurality of probe pads are divided into a plurality of groups, which are circumferentially arranged at peripheral portions of the upper surface of the probe card.

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First Claim

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Patent Owner(s)

  • TOKYO ELECTRON LIMITED

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iino, Shinji Yamanashi-ken, JP 53 662

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