Thin film capacitors and process for making them

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6075691
SERIAL NO

08918174

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A thin film capacitor for use in semiconductor integrated circuit devices such as analog circuits, rf circuits, and dynamic random access memories (DRAMs), and a method for its fabrication, is disclosed. The capacitor has a dielectric thickness less than about 50 nm, a capacitance density of at least about 15 fF/.mu.m.sup.2, and a breakdown field of at least about 1 MV/cm. The dielectric material is a metal oxide of either titanium, niobium, or tantalum. The metal oxide can also contain silicon or nitrogen. The dielectric material is formed over a first electrode by depositing the metal onto the substrate or onto a first electrode formed on the substrate. The metal is then anodically oxidized to form the dielectric material of the desired thickness. A top electrode is then formed over the dielectric layer. The top electrode is a metal that does not degrade the electrical characteristics (e.g. the leakage current or the breakdown voltage) of the dielectric layer.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.SINGAPORE, SG22265
LUCENT TECHNOLOGIES INC.MURRAY HILL, NJ6819

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Duenas, Salvador Summit, NJ 1 68
Kola, Ratnaji Rao Berkeley Heights, NJ 3 153
Kumagai, Henry Y Orefield, PA 5 151
Lau, Maureen Yee Warren, NJ 2 105
Sullivan, Paul A Summit, NJ 9 476
Tai, King Lien Berkeley Heights, NJ 34 989

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (2)
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* 5382347 Protective coatings for metal parts to be used at high temperatures 11 1992
 
NEC CORPORATION (2)
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* 5670408 Thin film capacitor with small leakage current and method for fabricating the same 10 1995
 
TEXAS INSTRUMENTS INCORPORATED (9)
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* 5554866 Pre-oxidizing high-dielectric-constant material electrodes 60 1995
* 5605858 Method of forming high-dielectric-constant material electrodes comprising conductive sidewall spacers of same material as electrodes 37 1995
* 5656852 High-dielectric-constant material electrodes comprising sidewall spacers 23 1995
* 5696018 Method of forming conductive noble-metal-insulator-alloy barrier layer for high-dielectric-constant material electrodes 55 1995
* 5729054 Conductive noble-metal-insulator-alloy barrier layer for high-dielectric-constant material electrodes 69 1995
* 5793057 Conductive amorphous-nitride barrier layer for high dielectric-constant material electrodes 55 1995
* 5811851 Pre-oxidizing high-dielectric-constant material electrodes 25 1996
 
ROHM CO., LTD. (1)
* 5486977 Tantalum capacitor chip, process for making the same and tantalum capacitor incorporating the same 8 1993
 
BELL TELEPHONE LABORATORIES, INCORPORATED (1)
* 4374159 Fabrication of film circuits having a thick film crossunder and a thin film capacitor 8 1981
 
FUJITSU LIMITED (1)
* 4364099 Tantalum thin film capacitor 38 1980
 
HITACHI, LTD. (1)
* 5177670 Capacitor-carrying semiconductor module 166 1992
 
NEC ELECTRONICS CORPORATION (1)
* 5696017 Method of fabricating a semiconductor device with a capacitor structure having increased capacitance 53 1994
 
AT & T TECHNOLOGIES, INC., (1)
* 4491509 Methods of and apparatus for sputtering material onto a substrate 15 1984
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
PROTEUS DIGITAL HEALTH, INC. (1)
8786049 Solid-state thin-film capacitor 0 2010
 
LUCENT TECHNOLOGIES INC. (2)
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SONY CORPORATION (1)
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PANASONIC CORPORATION (2)
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SPTS TECHNOLOGIES LIMITED (1)
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SAE MAGNETICS (H.K.) LTD. (2)
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TRIKON HOLDINGS LIMITED (1)
6936481 Method of depositing dielectric 0 2003
 
GLOBALFOUNDRIES INC. (2)
6992344 Damascene integration scheme for developing metal-insulator-metal capacitors 9 2002
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BLACKBERRY LIMITED (7)
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JUSUNG ENGINEERING CO., LTD. (1)
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INFINEON TECHNOLOGIES AG (1)
* 2012/0057,270 CAPACITOR AND METHOD FOR MAKING SAME 3 2010
 
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UNIVERSITY OF MARYLAND, BALTIMORE (2)
* 8912522 Nanodevice arrays for electrical energy storage, capture and management and method for their formation 2 2010
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Ultrasource, Inc. (8)
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6998696 Integrated thin film capacitor/inductor/interconnect system and method 8 2003
6890629 Integrated thin film capacitor/inductor/interconnect system and method 10 2003
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7425877 Lange coupler system and method 1 2005
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AMKOR TECHNOLOGY, INC. (1)
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APPLIED MATERIALS, INC. (1)
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SHOWA DENKO K.K. (3)
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HYNIX SEMICONDUCTOR INC. (1)
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H.C. STARCK GMBH (1)
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* Cited By Examiner