Aluminum composite material of low-thermal expansion and high-thermal conductivity and method of producing same

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United States of America Patent

PATENT NO 6077327
SERIAL NO

08821073

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Abstract

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There is disclosed a method of producing an aluminum composite material in which the content of silicon carbide can be made higher as compared with conventional methods, and the production cost is low, and the method can be carried out easily. An aluminum composite material of low-thermal expansion and high-thermal conductivity is produced by this method. A mixture of powder of aluminum metal or an alloy thereof and silicon carbide powder is pressurized and compacted to form a green compact. Subsequently, this green compact is charged into a mold, and is heated and compacted into a predetermined shape at a temperature not less than a melting point of the aluminum metal or the alloy thereof.

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Patent Owner(s)

Patent OwnerAddress
HITACHI METALS LTDTOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukui, Satoshi Kitakyushu, JP 33 589
Hamayoshi, Shigeyuki Kitakyushu, JP 5 113
Ohshima, Masahiko Kitakyushu, JP 2 16
Shimizu, Kenichiro Kitakyushu, JP 8 25

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