Method of forming an adhesive connection
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 20, 2000
Issued Date -
N/A
app pub date -
Mar 9, 1998
filing date -
Jun 30, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Solid spheres of substantially uniform size and shape and coated with a lower temperature melting material are formed for use in interconnect arrays, solder pastes, Z-axis conduction adhesives, etc. Drops of two materials are merged in flight forming a coating of the lower melting temperature material on the drop of higher melting temperature material.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully