Mounting method of semiconductor chip
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United States of America Patent
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Jun 20, 2000
Grant Date -
N/A
app pub date -
May 8, 1998
filing date -
May 9, 1997
priority date (Note) -
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Abstract
The invention provides a mounting method for a semiconductor chip, wherein after disposing the anisotropic conductive adhesive on a circuit board, the circuit board is preheated to a temperature lower than the hardening temperature of the anisotropic conductive adhesive, the semiconductor chip is disposed on the circuit board thereafter, and the anisotropic conductive adhesive is hardened by thermally press-bonding the semiconductor chip onto the circuit board by applying pressure as well as heat so that generation of air bubbles is minimized ensuring good adhesion therebetween. It is also possible to prevent occurrence of thermal strain by heating simultaneously the under surface of the circuit board at a temperature lower than a heating temperature for the semiconductor chip.
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