Method for assembling multichip modules
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United States of America Patent
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Jun 20, 2000
Grant Date -
N/A
app pub date -
Sep 3, 1992
filing date -
Sep 3, 1992
priority date (Note) -
In Force
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Abstract
A multichip module is assembled using flip-chip bonding technology, a stencil printable solder paste and standard surface mount equipment for interconnecting signaling input/output contact pads on devices within such multichip module.
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