Method of producing a semiconductor device using a reduced mounting area
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United States of America Patent
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Jun 27, 2000
Grant Date -
N/A
app pub date -
Dec 23, 1998
filing date -
Dec 25, 1997
priority date (Note) -
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Abstract
An object of the present invention is to provide a method of manufacturing a semiconductor device which enables a decrease in mounting area on a printed circuit board and an increase in space efficiency on the printed circuit board. The method of manufacturing a semiconductor device, comprises the steps of: (1) preparing a common substrate which has a plurality of unit portions for accommodating at least a semiconductor chip on each of the unit portions; (2) mounting at least a semiconductor chip on each of the unit portions; (3) supplying a thermosetting resin on a surface of the common substrate, the unit portions including semiconductor chips being covered with the thermosetting resin continuously, and hardening the thermosetting resin by heat treatment to form a solid resin body; (4) leveling the resin body on the common substrate for forming a level surface thereon; and (5) cutting the common substrate and resin body at each side of each unit portion for separating the unit portions into individual unit portions.
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