Semiconductor package assemblies with moisture vents
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United States of America Patent
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Jun 27, 2000
Grant Date -
N/A
app pub date -
Apr 14, 1998
filing date -
Apr 14, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor chip package includes a semiconductor chip having surfaces and contacts, a layer of a moisture-permeable material bonded to one surface of the chip and a moisture-impermeable encapsulant overlying the moisture-permeable material and at least partially surrounding the chip. The package has exposed exterior surfaces and terminals on at least one of the exposed exterior surfaces which are electrically connected to the contacts. The moisture-permeable material extends to at least one of the exposed exterior surfaces so that moisture may be vented through the moisture-permeable material and out of the package. In certain embodiments, the moisture-permeable material includes a compliant layer having silicone and the moisture-impermeable material includes an epoxy.
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