Heat dissipation system having releasable attachment assembly
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United States of America Patent
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-
Jul 4, 2000
Grant Date -
N/A
app pub date -
Feb 6, 1998
filing date -
Feb 6, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A heat dissipation system for a heat generating electronic device includes a releasable attachment assembly for removably securing a heat sink to a heat spreader plate thereof includes at least one spring clip for biasing the heat spreader plate into a secured engagement with the heat sink. The spring clips are adapted to allow easy engagement and/or disengagement of the heat sink from the heat spreader plate, thereby facilitating the use of variously configured heat sinks as part of the heat dissipation system.
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