Method of forming interconnections on electronic modules
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jul 4, 2000
Grant Date -
N/A
app pub date -
Jun 23, 1997
filing date -
Jun 23, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method which utilizes flip chip technology to provide interconnection between printed circuit boards and integrated circuits is disclosed. The method involves metallization of the bond pad and multiple, novel bump compositions and coating compositions to provide an interconnection which is reliable and which withstands differences in the coefficient of thermal expansion between the silicon device and the bump material.
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