Packaging method of thin film passive components on silicon chip
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United States of America Patent
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Jul 4, 2000
Grant Date -
N/A
app pub date -
Sep 20, 1999
filing date -
Jul 1, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to a packaging method of thin film passive components on silicon chip, which employs ceramic or glass substrate to be mounted with the silicon chip so as to improve the mechanical strength of the components, and to a method of using thick film packaging technology to package the component. The cycle time of packaging is saved and the production cost is low.
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