Method of patterning a semiconductor device
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United States of America Patent
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Jul 4, 2000
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N/A
app pub date -
May 26, 1998
filing date -
May 26, 1998
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Abstract
A method for forming semiconductor devices involves defining a pattern of microspheres on a first structure and transferring that pattern of microspheres to a semiconductor structure. The microspheres may then be used as a mask to define features on the semiconductor structure. In this way, it is possible to form semiconductor devices without necessarily using a stepper. This may result in substantial capital savings in semiconductor manufacturing processes.
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