Fabrication of components by coining
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jul 4, 2000
Grant Date -
N/A
app pub date -
Dec 12, 1997
filing date -
Dec 13, 1996
priority date (Note) -
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Abstract
Metallic elements such as leads for connection to a semiconductor chip are made by embossing a metal sheet to form thin and thick regions, then etching or otherwise removing metal from the sheet in a nonselective removal process and arresting the removal process when the thin regions are removed but before the thick regions are removed. A base material may be applied to the metal sheet to form a dielectric layer before the removal step, so that the metallic leads left after the removal step are supported by the dielectric layer.
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