Epoxy resin composition and semiconductor device
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United States of America Patent
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-
Jul 4, 2000
Grant Date -
N/A
app pub date -
Dec 18, 1997
filing date -
Dec 19, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, there are blended a salt of trimellitic anhydride with 1,8-diazabicyclo(5.4.0)undecene-7 as a curing accelerator and a mercapto-containing silane coupling agent. The composition is shelf stable and smoothly flowing and cures into a product having improved adhesion, moisture resistance and electrical properties. The composition is suitable for the encapsulation of semiconductor devices.
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