Importance

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Abstract

In a stack type semiconductor device 1, front ends of leads 11 provided at two sides of a first semiconductor device 10 are bent inward to hold a second semiconductor device 20 stacked at the rear surface of the first semiconductor device 10. Since the second semiconductor device 20 is held toward the inside relative to the leads 11 of the first semiconductor device 10, the distance between the outer surfaces of the leads 11 does not increase. Thus, the mounting area does not increase compared to the mounting area required when mounting a single first semiconductor device 10, and furthermore, high density mounting becomes possible by stacking the second semiconductor device 20.

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First Claim