Semiconductor device comprising stacked semiconductor elements
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jul 4, 2000
Grant Date -
N/A
app pub date -
Feb 3, 1999
filing date -
Aug 26, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Electrodes of a semiconductor element are connected to lead wires provided on a flexible substrate, thereby forming a structural unit of a semiconductor element. A plurality of structural unit of a semiconductor elements are stacked on a mounting board, and the lead wires of each flexible substrate are electrically connected to wiring patterns on the package board. The stacked structure units of semiconductor elements are sealed on a package board through use of resin.
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