Low cost high power hermetic package with electrical feed-through bushings
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United States of America Patent
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-
Jul 4, 2000
Grant Date -
N/A
app pub date -
Jul 9, 1998
filing date -
Jul 9, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for providing pre-placed, pre-brazed feed throughs in the substrate of a hermetic package corresponding to the terminal leads of the encased circuit COTS components. The substrate may include directly bonded copper (DBC) regions forming circular shapes where the holes for the special connectors of the present invention will be located. These holes will correspond to the leads of the COTS component that will be mounted to it. Holes are laser or mechanically drilled into the substrate inside the circular shapes formed in the DBC. To form the feed through, a bushing, such as a blind copper rivet, is brazed in the hole, with the open end thereof oriented toward the component-side of the substrate. These open ends can accept the leads of the COTS component, like the holes of a conventional PC circuit board.
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